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Product Engineer - (HBM) High Bandwidth Memory

Company: Micron Technology, Inc.
Location: boise
Posted on: May 3, 2021

Job Description:

Micron's vision is to transform how the world uses information to enrich life for all. Join an inclusive team focused on one thing: using our expertise in the relentless pursuit of innovation for customers and partners. The solutions we create help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can spark the very innovation we are pursuing.

Req. ID: 258390

As a Product Engineer on the (HBM) High Bandwidth Memory technology you will be tasked with the development of JEDEC-HBM or alternative Near Memory DRAM solutions. Product Engineers are the key interface between Research and Development, Manufacturing, Marketing, and Quality Assurance departments. This is critical to Micron as it serves the company's charter to be the most cost-effective producer of DRAM memory.

Responsibilities and Tasks:

As a Product Engineer you will develop each new generation of DRAM memory as it transitions from the design stage to mass production. Your job duties will include understanding the JEDEC specifications for HBM and creating and implementing key DFT features, critical to fully testing the memory cube in production. This will also involve creating ways to characterize, debug and validate this new technology along with circuit debug, device characterization and improved operation and testability. Other responsibilities include circuit simulation, failure analysis, assistance with both internal qualification and customer implementation, yield optimization and test program development at the wafer-level and at the cube.

Minimum Experience:

5+ years of Proven experience in semiconductor/memory field.

Preferred Experience:

5+ years of Proven experience in HBM test.

Education:

A bachelor's or master's degree in Electrical/Computer Engineering or related field.

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions. Through our global brands - Micron and Crucial - our broad portfolio of high-performance memory and storage technologies, including DRAM, NAND, 3D XPoint memory and NOR, is transforming how the world uses information to enrich life. Backed by more than 40 years of technology leadership, our memory and storage solutions enable disruptive trends, including artificial intelligence, 5G, machine learning and autonomous vehicles, in key market segments like mobile, data center, client, consumer, industrial, graphics, automotive, and networking. Our common stock is traded on the Nasdaq under the MU symbol. To learn more visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

Micron prohibits the use of child labor and complies with all applicable laws, rules, regulations and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron's Human Resources Department at 1-800-336-8918 or 208-368-4748 and/or by completing our General Contact Form

Keywords: Boise || Idaho (US-ID) || United States (US) || DEG (DRAM Engineering Group) || Experienced || Regular || Engineering || #LI-MT1 || Tier 4 ||

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Keywords: Micron Technology, Inc., Boise , Product Engineer - (HBM) High Bandwidth Memory, Other , boise, Idaho

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