Micron's vision is to transform how the world uses information
to enrich life for all. Join an inclusive team focused on one
thing: using our expertise in the relentless pursuit of innovation
for customers and partners. The solutions we create help make
everything from virtual reality experiences to breakthroughs in
neural networks possible. We do it all while committing to
integrity, sustainability, and giving back to our communities.
Because doing so can spark the very innovation we are pursuing.
Req. ID: 258390
As a Product Engineer on the (HBM) High Bandwidth Memory
technology you will be tasked with the development of JEDEC-HBM or
alternative Near Memory DRAM solutions. Product Engineers are the
key interface between Research and Development, Manufacturing,
Marketing, and Quality Assurance departments. This is critical to
Micron as it serves the company's charter to be the most
cost-effective producer of DRAM memory.
Responsibilities and Tasks:
As a Product Engineer you will develop each new generation of
DRAM memory as it transitions from the design stage to mass
production. Your job duties will include understanding the JEDEC
specifications for HBM and creating and implementing key DFT
features, critical to fully testing the memory cube in production.
This will also involve creating ways to characterize, debug and
validate this new technology along with circuit debug, device
characterization and improved operation and testability. Other
responsibilities include circuit simulation, failure analysis,
assistance with both internal qualification and customer
implementation, yield optimization and test program development at
the wafer-level and at the cube.
5+ years of Proven experience in semiconductor/memory field.
5+ years of Proven experience in HBM test.
A bachelor's or master's degree in Electrical/Computer
Engineering or related field.
About Micron Technology, Inc.
We are an industry leader in innovative memory and storage
solutions. Through our global brands - Micron and Crucial - our
broad portfolio of high-performance memory and storage
technologies, including DRAM, NAND, 3D XPoint memory and NOR, is
transforming how the world uses information to enrich life. Backed
by more than 40 years of technology leadership, our memory and
storage solutions enable disruptive trends, including artificial
intelligence, 5G, machine learning and autonomous vehicles, in key
market segments like mobile, data center, client, consumer,
industrial, graphics, automotive, and networking. Our common stock
is traded on the Nasdaq under the MU symbol. To learn more visit
All qualified applicants will receive consideration for
employment without regard to race, color, religion, sex, sexual
orientation, gender identity, national origin, veteran or
Micron prohibits the use of child labor and complies with all
applicable laws, rules, regulations and other international and
industry labor standards.
Micron does not charge candidates any recruitment fees or
unlawfully collect any other payment from candidates as
consideration for their employment with Micron.
For US Sites Only: To request assistance with the application
process and/or for reasonable accommodations, please contact
Micron's Human Resources Department at 1-800-336-8918 or
208-368-4748 and/or by completing our General Contact Form
Keywords: Boise || Idaho (US-ID) || United States (US) || DEG
(DRAM Engineering Group) || Experienced || Regular || Engineering
|| #LI-MT1 || Tier 4 ||